Part Number Hot Search : 
N4005 KBP310 LCX16 M5232 KBPC351 BD205 DTC144 D4023BC
Product Description
Full Text Search

LRS1380J - STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM

LRS1380J_1737143.PDF Datasheet

 
Part No. LRS1380J
Description STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM

File Size 4,176.10K  /  56 Page  

Maker


Sharp Electrionic Components



JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: LRS1356
Maker: SHARP
Pack: BGA
Stock: 9720
Unit price for :
    50: $7.75
  100: $7.37
1000: $6.98

Email: oulindz@gmail.com

Contact us

Homepage http://sharp-world.com/products/device/
Download [ ]
[ LRS1380J Datasheet PDF Downlaod from Datasheet.HK ]
[LRS1380J Datasheet PDF Downlaod from Maxim4U.com ] :-)


[ View it Online ]   [ Search more for LRS1380J ]

[ Price & Availability of LRS1380J by FindChips.com ]

 Full text search : STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 4M (X 16) SRAM


 Related Part Number
PART Description Maker
LRS1383H STACKED CHIP 32M (X 16) BOOT BLOCK FLASH AND 8M (X 16) SRAM
Sharp Electrionic Components
S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFW Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
SPANSION[SPANSION]
MB84VD22281EA-90-PBS MB84VD22282EA-90-PBS MB84VD22 Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 8M(x8/x16) static RAM
32M (x 8/x16) FLASH MEMORY & 8M (x 8/x16) STATIC RAM
Fujitsu Microelectronics
IBM13M32734BCA 32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)
International Business Machines, Corp.
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
Spansion Inc.
Spansion, Inc.
S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
Spansion Inc.
Spansion, Inc.
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Spansion, Inc.
SPANSION LLC
KMM372V3200BS1 32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块)
Samsung Semiconductor Co., Ltd.
LRS1302 LRS13023 Stacked Chip 8M Flash and 1M SRAM
SHARP[Sharp Electrionic Components]
S75WS256NDFBFWPB S75WS256NDFBFWPA Stacked Multi-Chip Product (MCP)
http://
LRS1329 Stacked Chip 16M Flash and 2M SRAM
Sharp Electrionic Components
 
 Related keyword From Full Text Search System
LRS1380J bridge LRS1380J channel LRS1380J pwm LRS1380J speech voice LRS1380J Supply
LRS1380J ic查找网站 LRS1380J reference LRS1380J transistor LRS1380J resistor LRS1380J Integrated
 

 

Price & Availability of LRS1380J

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.8393349647522